A hands-on exploration of semiconductor packaging — covering package types, ATMP processes, thermal simulation of flip-chip BGA packages, reliability testing, and 3D package cross-section modeling using ANSYS Electronics Desktop (AEDT).
Unpublished patent-pending architecture for practical NVIDIA-class CoWoP realization in AI/HPC GPU systems.
免费中文先进封装课程 / Free Chinese-language course: 40 lessons on Chiplets, HBM, 2.5D/3D, engineering, and industry research.
SCITEO (峻茂新材料) | −255 to 1000 °C, 1.5–60 W/m·K, CTE 7.1–40 ppm/°C, modulus 2.6–15 GPa, shear 5–32 MPa. Seven product lines for semiconductor packaging, automotive electronics, extreme-temperature components and ultra-precision manufacturing.
SCITEO 峻茂新材料 — high-end advanced adhesives manufacturer: −255 to 1000 °C, 1.5–60 W/m·K, CTE 7.1–40 ppm/°C, modulus 2.6–15 GPa. Semiconductor packaging, automotive, extreme-temperature and ultra-precision manufacturing.
Analytical warpage & thermo-mechanical stress toolkit for wafer-level packaging (WLP): Stoney / Timoshenko / N-layer laminate models, interactive Streamlit dashboard, validated against classical closed-form results.
End-to-end fabrication and characterization of a glass-core package substrate for heterogeneous integration.
Amkor Technology — independent third-party profile of a public API surface, by API Evangelist. Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries.
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